Joining our Talent Network will enhance your job search and application process. Whether you choose to apply or just leave your information, we look forward to staying connected with you.
-Main Job 1: R&D packaging for Electronic Products: Design structure, packing test, create BOM, documents, qualify samples.. on projects
-Main Job 2: Work with Suppliers to process packaging items.
-Main Job 3: Work with Customer, MKT, NPI, QM, Production on develop and run projects.
-Main Job 4: Others task will be assigned from Supervisor
Deadline to apply: 30/09/2023
Ho Chi Minh
Ho Chi Minh, Dong Nai
Ho Chi Minh, Dong Nai, Binh Duong